240 million yuan Nanjing University semiconductor equipment and new electronic materials project signed in Tangshan, expected to be put into operation in May next year

According to Cao Feidian’s announcement, on November 26, the signing ceremony of the Nanjing University semiconductor Equipment and New Electronic Materials Project was held.

240 million yuan Nanjing University semiconductor equipment and new electronic materials project signed in Tangshan, expected to be put into operation in May next year

Picture source: Cao Feidian release

According to Cao Feidian’s announcement, Nanjing University’s semiconductor equipment and new electronic materials project plans a total investment of 240 million yuan, with an expected annual output value of not less than 320 million yuan. The company registration has been completed and the plant decoration design is in progress. It is expected to start production in May next year.

It is understood that the semiconductor equipment and electronic new materials project of Nanjing University is invested and constructed by a team of two national leading talents, Professor Ge Haixiong and Ning Xinghai of Nanjing University. The technical parameters of the film forming equipment independently developed by the team have all reached international standards. Currently, the first set of film forming equipment has been put into use in Hefei BOE. The smooth implementation of this technology has accurately solved the current dilemma of importing all low-resistance film-forming equipment in the domestic semiconductor industry from Europe.

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