Barcelona, Spain, June 28, 2021, Mobile World Congress 2021 – Shenzhen Jieyang Microelectronics announced that it has adopted Rohde & Schwarz test solutions for UWB physical layer testing. Rohde & Schwarz has developed UWB test solutions for R&D, certification and production, including elements such as Time of Flight (ToF) and Angle of Arrival (AoA) measurements as well as equipment calibration procedures. Among them, the R&S CMP200 wireless communication tester from Rohde & Schwarz is ideal for solving UWB test challenges in production and R&D. It integrates the functions of a signal analyzer and a signal generator on the same instrument. Combined with Rohde & Schwarz’s WMT software for wireless production automation testing and a broad portfolio of shielded enclosures, the R&S CMP200 provides IEEE 802.15.4a compliant measurements for transmitters, receivers, ToF and AoA in conducted and radiated modes A complete solution for the /z specification. As a mid-range vector signal generator with frequencies up to 44 GHz, the R&S SMM100A is the only instrument in its class that can provide a maximum RF modulation bandwidth of 1 GHz, thus meeting the wideband signal generation requirements for UWB equipment in R&D and production.
Shenzhen Jieyang Microelectronics is developing a complete SoC solution for UWB, including RF transceiver, baseband, integrated protocol and integrated MCU. The RF transceiver features a fully integrated receiver and transmitter with on-chip antenna switches and power amplifiers with transmit power over 10 dBm for better ranging distances. By eliminating the need for external switches/power amplifiers/baluns/transformers, BoM cost and size can be greatly reduced, which is critical for mobile phone and wearable/tag/digital key applications where space is often limited. The SoC supports up to 4 antennas for 3D Angle of Arrival (AoA), instantly distinguishing front and rear angular directions. The SoC embeds an ARM Cortex-M CPU processor, running software and protocols in SRAM and non-volatile memory (NVM). The SoC can operate as a standalone application processor when needed, while providing multiple interfaces such as SPI, I2C, UART, and GPIO for interfacing with external processors or sensors. The SoC also embeds AES-128 and AES-256 as part of a secure element for UWB secure ranging applications, as well as standalone data security and privacy-preserving applications. Leveraging advanced 22 nm RF ULL process technology, this UWB SoC achieves extremely low power consumption and compact size, making it ideal for wearable device/tag/digital key applications.
Since the fourth quarter of 2020, Shenzhen Jieyang Microelectronics has been using UWB test solutions from Rohde & Schwarz to complete the test topics defined by organizations such as IEEE and FiRa Alliance, with test cases covering BPRF (Basic Pulse Repetition Frequency) and HPRF (high pulse repetition rate). Mr. Bill Zhang, CEO of Shenzhen Jieyang Microelectronics, said: “UWB will become a standard wireless technology that can be seen everywhere because UWB provides unprecedented reliable, safe, accurate, fast and power-saving ranging and positioning capabilities. Schwarz’s UWB tester solutions have greatly helped us to complete UWB conformance and interoperability testing, ensuring that our UWB chips can be adopted by all segments of the market and suppliers. We provide UWB chips and chipsets It will fully meet market needs, promote market penetration and ease of use of UWB.” Alexander Pabst, Vice President Wireless Communications Marketing at Rohde & Schwarz, said: “Rohde & Schwarz recognizes the power of secure and reliable UWB technology. , and are also pleased to offer our best-in-class test solutions to industry players around the world. We worked closely with FiRa to validate the R&S CMP200 as a physical layer test platform.”
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