The first joint-venture automotive chip design company of Chinese OEMs was established, opening up the entire industrial chain for mutual benefit and win-win results

According to the official news from BAIC Production and Investment, BAIC Production and Investment signed an agreement with Imagination Group and Cuiwei Co., Ltd. to jointly establish Beijing Hexinda Technology Co., Ltd.

Specifically, the company is the first automotive chip design company jointly established by a Chinese state-owned vehicle enterprise and an international chip giant. It will focus on the research and development of application processors for autonomous driving and voice interaction chips for smart cockpits. The domestic auto companies represented by BAIC Group provide advanced solutions in the field of automotive chips.

BAIC Production and Investment stated that this strategic cooperation is an important measure for BAIC and Imagination to build an intelligent connected vehicle-grade chip and promote the intelligent development of the global automobile industry. Based on Imagination’s basic advantages in neural network acceleration (NNA), the joint venture will develop an “integrated storage and computing” SoC chip with its own core patent to further improve the application of the existing chip product matrix in the field of in-vehicle voice interaction.

In addition, the joint venture will continue to promote the development of ADAS and intelligent driving perception chips based on Imagination’s performance advantages in the field of GPU and image processing, as well as the current development trend of vision and structured light fusion perception.

At the same time, the joint venture will focus on the research and development of application processors for autonomous driving and voice interaction chips for intelligent cockpits. With the advantages of Imagination’s IP platform, the ecological advantages of BAIC Group’s vehicle manufacturing, and the rich industry experience of the management team, it will be able to connect from The whole industry chain layout from IP to chip to vehicle.

Finally, BAIC Production and Investment also revealed that the intelligent driving warehouse chip based on voice interaction and the L3-L5 multi-level environment perception solution are expected to be successfully taped and mass-produced in 2021 and 2022, respectively.

The Links:   7MBI100U4S-120 NL204153AC21-17

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